Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Not Compliant |
Bus Hold | No |
Mounting | Surface Mount |
Polarity | Non-Inverting |
ECCN (US) | EAR99 |
Packaging | Tube |
Pin Count | 20 |
Automotive | No |
Lead Shape | Flat |
Output Type | 3-State |
PCB changed | 20 |
Part Status | Active |
Logic Family | ABT |
Package Width | 7.62(Max) |
Logic Function | Buffer/Line Driver |
Package Height | 2.45(Max) |
Package Length | 13.72(Max) |
Supplier Package | CFPAK |
Input Signal Type | Single-Ended |
Process Technology | BiCMOS |
Standard Package Name | FPAK |
Number of Inputs per Chip | 8 |
Number of Outputs per Chip | 8 |
Supplier Temperature Grade | Military |
Number of Channels per Chip | 8 |
Number of Elements per Chip | 2 |
Maximum Quiescent Current (uA) | 30000 |
Typical Quiescent Current (uA) | 24000 |
Number of Input Enables per Chip | 0 |
Number of Output Enables per Chip | 1 Low/1 High |
Maximum Operating Temperature (°C) | 125 |
Minimum Operating Temperature (°C) | -55 |
Absolute Propagation Delay Time (ns) | 7.9 |
Maximum Operating Supply Voltage (V) | 5.5 |
Minimum Operating Supply Voltage (V) | 4.5 |
Typical Operating Supply Voltage (V) | 5 |
Maximum Low Level Output Current (mA) | 48 |
Propagation Delay Test Condition (pF) | 50 |
Maximum High Level Output Current (mA) | -24 |
Maximum Propagation Delay Time @ Maximum CL (ns) | 4.2@5V |
Description |