Product Attribute | Attribute Value |
HTS | 8542330001 |
PPAP | No |
Bus Hold | No |
Mounting | Surface Mount |
Polarity | Non-Inverting |
ECCN (US) | EAR99 |
Packaging | Strip |
Pin Count | 20 |
Automotive | No |
Lead Shape | Flat |
Output Type | 3-State |
PCB changed | 20 |
Part Status | Active |
Logic Family | AC |
Package Width | 7.24(Max) |
Logic Function | Buffer/Line Driver |
Package Height | 2.21(Max) |
Package Length | 13.08(Max) |
Supplier Package | CFPAK |
Input Signal Type | Single-Ended |
Process Technology | CMOS |
Standard Package Name | FPAK |
Number of Inputs per Chip | 8 |
Number of Outputs per Chip | 8 |
Supplier Temperature Grade | Military |
Number of Channels per Chip | 8 |
Number of Elements per Chip | 1 |
Maximum Power Dissipation (mW) | 500 |
Maximum Quiescent Current (uA) | 80 |
Number of Input Enables per Chip | 0 |
Number of Output Enables per Chip | 2 Low |
Maximum Operating Temperature (°C) | 125 |
Minimum Operating Temperature (°C) | -55 |
Absolute Propagation Delay Time (ns) | 15 |
Maximum Operating Supply Voltage (V) | 6 |
Minimum Operating Supply Voltage (V) | 2 |
Typical Operating Supply Voltage (V) | 2.5|3.3|5 |
Maximum Low Level Output Current (mA) | 50 |
Propagation Delay Test Condition (pF) | 50 |
Maximum High Level Output Current (mA) | -50 |
Maximum Propagation Delay Time @ Maximum CL (ns) | 10@3V|7@4.5V |
Description |