Product Attribute | Attribute Value |
HTS | 8542.39.00.01 |
PPAP | No |
EU RoHS | Compliant |
Bus Hold | No |
Mounting | Surface Mount |
Polarity | Non-Inverting |
ECCN (US) | EAR99 |
Pin Count | 6 |
Automotive | No |
Lead Shape | No Lead |
Output Type | 3-State |
PCB changed | 6 |
Part Status | Active |
Logic Family | AUP |
Package Width | 1 |
Logic Function | Buffer/Line Driver |
Package Height | 0.37 |
Package Length | 1.4 |
Supplier Package | X2-DFN |
Input Signal Type | Single-Ended |
Process Technology | CMOS |
Standard Package Name | DFN |
Number of Inputs per Chip | 1 |
Number of Outputs per Chip | 1 |
Number of Channels per Chip | 1 |
Number of Elements per Chip | 1 |
Maximum Quiescent Current (uA) | 0.5 |
Number of Input Enables per Chip | 0 |
Number of Output Enables per Chip | 1 High |
Maximum Operating Temperature (°C) | 125 |
Minimum Operating Temperature (°C) | -40 |
Absolute Propagation Delay Time (ns) | 24 |
Maximum Operating Supply Voltage (V) | 3.6 |
Minimum Operating Supply Voltage (V) | 0.8 |
Typical Operating Supply Voltage (V) | 1.8|2.5|3.3 |
Maximum Low Level Output Current (mA) | 4 |
Propagation Delay Test Condition (pF) | 30 |
Maximum High Level Output Current (mA) | -4 |
Maximum Propagation Delay Time @ Maximum CL (ns) | 18.7@1.1V to 1.3V|10.8@1.4V to 1.6V|8.4@1.65V to 1.95V|6.3@2.3V to 2.7V|5.8@3V to 3.6V |
Description |