Product Attribute | Attribute Value |
HTS | 8542.31.00.01 |
PPAP | No |
EU RoHS | Compliant |
Bus Hold | No |
Mounting | Surface Mount |
Polarity | Non-Inverting |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 20 |
Automotive | No |
Lead Shape | Gull-wing |
Output Type | 3-State |
PCB changed | 20 |
Part Status | Obsolete |
Logic Family | F |
Package Width | 7.5 |
Logic Function | Buffer/Line Driver |
Package Height | 2.35(Max) |
Package Length | 12.8 |
Supplier Package | SOIC W |
Input Signal Type | Single-Ended |
Process Technology | Bipolar |
Standard Package Name | SOP |
Number of Inputs per Chip | 8 |
Number of Outputs per Chip | 8 |
Number of Channels per Chip | 8 |
Number of Elements per Chip | 2 |
Number of Input Enables per Chip | 0 |
Number of Output Enables per Chip | 2 Low |
Maximum Operating Temperature (°C) | 70 |
Minimum Operating Temperature (°C) | 0 |
Absolute Propagation Delay Time (ns) | 8 |
Maximum Operating Supply Voltage (V) | 5.5 |
Minimum Operating Supply Voltage (V) | 4.5 |
Typical Operating Supply Voltage (V) | 5 |
Maximum Low Level Output Current (mA) | 64 |
Propagation Delay Test Condition (pF) | 50 |
Maximum High Level Output Current (mA) | -15 |
Maximum Propagation Delay Time @ Maximum CL (ns) | 5.2@5V |
Description |