Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Not Compliant |
Bus Hold | No |
Mounting | Surface Mount |
Polarity | Non-Inverting |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 5 |
Automotive | No |
Lead Shape | Ball |
Output Type | 3-State |
PCB changed | 5 |
Part Status | Obsolete |
Logic Family | AUC |
Logic Function | Buffer/Line Driver |
Package Height | 0.3 |
Supplier Package | DSBGA |
Input Signal Type | Single-Ended |
Tolerant I/Os (V) | 3.6 |
Process Technology | CMOS |
Standard Package Name | BGA |
Number of Inputs per Chip | 1 |
Number of Outputs per Chip | 1 |
Supplier Temperature Grade | Commercial |
Number of Channels per Chip | 1 |
Number of Elements per Chip | 1 |
Maximum Quiescent Current (uA) | 10 |
Number of Input Enables per Chip | 0 |
Number of Output Enables per Chip | 1 Low |
Maximum Operating Temperature (°C) | 85 |
Minimum Operating Temperature (°C) | -40 |
Absolute Propagation Delay Time (ns) | 4.3 |
Maximum Operating Supply Voltage (V) | 2.7 |
Minimum Operating Supply Voltage (V) | 0.8 |
Typical Operating Supply Voltage (V) | 2.5|1.8 |
Maximum Low Level Output Current (mA) | 9 |
Propagation Delay Test Condition (pF) | 30 |
Maximum High Level Output Current (mA) | -9 |
Maximum Propagation Delay Time @ Maximum CL (ns) | 1.7@2.5V|2.5@1.8V |
Description |