Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 56 |
Automotive | No |
Lead Shape | Ball |
PCB changed | 56 |
Part Status | Obsolete |
Logic Family | CBT |
Configuration | 12 x 2:2 |
Package Width | 4.6(Max) |
Package Height | 0.65(Max) |
Package Length | 7.1(Max) |
Supplier Package | BGA MICROSTAR JUNIOR |
Process Technology | CMOS |
Standard Package Name | BGA |
Number of Inputs per Chip | 24 |
Number of Outputs per Chip | 24 |
Supplier Temperature Grade | Commercial |
Maximum On Resistance (Ohm) | 14(Typ) |
Number of Elements per Chip | 1 |
Maximum Quiescent Current (uA) | 3 |
Maximum Operating Temperature (°C) | 85 |
Minimum Operating Temperature (°C) | -40 |
Absolute Propagation Delay Time (ns) | 10.4 |
Maximum Operating Supply Voltage (V) | 5.5 |
Minimum Operating Supply Voltage (V) | 4 |
Typical Operating Supply Voltage (V) | 5 |
Maximum Low Level Output Current (mA) | 128 |
Propagation Delay Test Condition (pF) | 50 |
Maximum High Level Output Current (mA) | -128 |
Maximum Propagation Delay Time @ Maximum CL (ns) | 0.35@4V|0.25@5V |
Description |