Product Attribute | Attribute Value |
HTS | 8542.39.00.01 |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tray |
Pin Count | 24 |
Automotive | No |
Lead Shape | No Lead |
PCB changed | 24 |
Part Status | Active |
Configuration | 10 x 1:1 |
Package Width | 4 |
Logic Function | Bus Switch |
Package Height | 0.83 |
Package Length | 4 |
Supplier Package | LFCSP EP |
Process Technology | CMOS |
Standard Package Name | CSP |
Number of Inputs per Chip | 10 |
Number of Outputs per Chip | 10 |
Supplier Temperature Grade | Industrial |
Maximum On Resistance (Ohm) | 15(Typ) |
Number of Elements per Chip | 1 |
Maximum Quiescent Current (uA) | 1200 |
Typical Quiescent Current (uA) | 650 |
Maximum Operating Temperature (°C) | 85 |
Minimum Operating Temperature (°C) | -40 |
Absolute Propagation Delay Time (ns) | 4.8 |
Maximum Operating Supply Voltage (V) | 3.6 |
Minimum Operating Supply Voltage (V) | 2.3 |
Typical Operating Supply Voltage (V) | 2.5|3.3 |
Maximum Low Level Output Current (mA) | 25 |
Propagation Delay Test Condition (pF) | 50 |
Maximum High Level Output Current (mA) | -25 |
Maximum Propagation Delay Time @ Maximum CL (ns) | 0.225@3V |
Description |