Product Attribute | Attribute Value |
HTS | 8542.31.00.01 |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 114 |
Automotive | No |
Lead Shape | Ball |
PCB changed | 114 |
Part Status | Obsolete |
Logic Family | FST |
Configuration | 12 x 1:1 |
Package Width | 5.5 |
Logic Function | Bus Switch |
Package Height | 0.95(Max) |
Package Length | 16 |
Supplier Package | FBGA |
Process Technology | CMOS |
Standard Package Name | BGA |
Number of Inputs per Chip | 48 |
Number of Outputs per Chip | 48 |
Maximum On Resistance (Ohm) | 11(Typ) |
Number of Elements per Chip | 4 |
Maximum Quiescent Current (uA) | 3 |
Maximum Operating Temperature (°C) | 85 |
Minimum Operating Temperature (°C) | -40 |
Absolute Propagation Delay Time (ns) | 7.2 |
Maximum Operating Supply Voltage (V) | 5.5 |
Minimum Operating Supply Voltage (V) | 4 |
Typical Operating Supply Voltage (V) | 5 |
Maximum Low Level Output Current (mA) | 128 |
Propagation Delay Test Condition (pF) | 50 |
Maximum High Level Output Current (mA) | -128 |
Maximum Propagation Delay Time @ Maximum CL (ns) | 0.25@4.5V to 5.5V |
Description |