Product Attribute | Attribute Value |
HTS | 8542.31.00.01 |
PPAP | No |
Bus Hold | No |
Mounting | Through Hole |
Polarity | Non-Inverting |
ECCN (US) | EAR99 |
Pin Count | 20 |
Automotive | No |
Lead Shape | Through Hole |
Input Level | TTL |
Output Type | 3-State |
PCB changed | 20 |
Part Status | Unconfirmed |
Logic Family | ABT |
Output Level | TTL |
Package Width | 7.87(Max) |
Logic Function | Bus Transceiver |
Package Height | 3.3(Max) |
Package Length | 26.92(Max) |
Supplier Package | CDIP |
Process Technology | BiCMOS |
Data Flow Direction | Bi-Directional |
Standard Package Name | DIP |
Supplier Temperature Grade | Military |
Number of Channels per Chip | 8 |
Number of Elements per Chip | 1 |
Maximum Quiescent Current (uA) | 30000 |
Typical Quiescent Current (uA) | 22000 |
Number of Direction Control Inputs | 0 |
Maximum Operating Temperature (°C) | 125 |
Minimum Operating Temperature (°C) | -55 |
Number of Input Enables per Element | 0 |
Absolute Propagation Delay Time (ns) | 8.5 |
Maximum Operating Supply Voltage (V) | 5.5 |
Minimum Operating Supply Voltage (V) | 4.5 |
Number of Output Enables per Element | 1 Low/1 High |
Maximum Low Level Output Current (mA) | 48 |
Propagation Delay Test Condition (pF) | 50 |
Maximum High Level Output Current (mA) | -24 |
Number of Selection Inputs per Element | 0 |
Maximum Propagation Delay Time @ Maximum CL (ns) | 4.2@5V |
Description |