Product Attribute | Attribute Value |
HTS | 8542.31.00.01 |
PPAP | No |
EU RoHS | Compliant |
Bus Hold | No |
Mounting | Through Hole |
Polarity | Non-Inverting |
ECCN (US) | EAR99 |
Packaging | Rail |
Pin Count | 20 |
Automotive | No |
Lead Shape | Through Hole |
Input Level | CMOS |
Output Type | 3-State |
PCB changed | 20 |
Part Status | Obsolete |
Logic Family | HC |
Output Level | CMOS |
Package Width | 7.11(Max) |
Logic Function | Bus Transceiver |
Package Height | 3.43(Max) |
Package Length | 26.92(Max) |
Supplier Package | PDIP W |
Process Technology | CMOS |
Data Flow Direction | Bi-Directional |
Standard Package Name | DIP |
Number of Channels per Chip | 8 |
Number of Elements per Chip | 1 |
Maximum Power Dissipation (mW) | 600 |
Maximum Quiescent Current (uA) | 8 |
Number of Direction Control Inputs | 1 Low/High |
Maximum Operating Temperature (°C) | 85 |
Minimum Operating Temperature (°C) | -40 |
Number of Input Enables per Element | 0 |
Absolute Propagation Delay Time (ns) | 300 |
Maximum Operating Supply Voltage (V) | 6 |
Minimum Operating Supply Voltage (V) | 2 |
Number of Output Enables per Element | 1 Low |
Maximum Low Level Output Current (mA) | 7.8 |
Propagation Delay Test Condition (pF) | 150 |
Maximum High Level Output Current (mA) | -7.8 |
Number of Selection Inputs per Element | 0 |
Maximum Propagation Delay Time @ Maximum CL (ns) | 96@2V|19@6V|22@4.5V |
Description |