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Combo Wireless Modules STM32WB55VGY6TR
STMicroelectronics
STM32WB55VGY6TR
--
RF and Microwave
Combo Wireless Modules
Specification
| Product Attribute | Attribute Value |
| PPAP | No |
| Style | Chip |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| ECCN (US) | 5A992.c |
| Packaging | Tape and Reel |
| Pin Count | 100 |
| Automotive | No |
| Lead Shape | Ball |
| PCB changed | 100 |
| Part Status | Active |
| Construction | BT+ZigBee |
| Package Width | 4.38 |
| Package Height | 0.38 |
| Package Length | 4.4 |
| WLAN Technology | IEEE 802.15.4 |
| Supplier Package | WLCSP |
| BT Protocol Supported | Bluetooth v5.2(BLE) |
| Standard Package Name | BGA |
| BT Frequency Range (MHz) | 2402 to 2480 |
| WLAN Maximum Output Power | 5.7dBm(Typ) |
| Supplier Temperature Grade | Industrial |
| WLAN Frequency Range (MHz) | 2405 to 2480 |
| WLAN Maximum Data Rate (MBps) | 0.25 |
| Maximum Operating Temperature (°C) | 85 |
| Minimum Operating Temperature (°C) | -40 |
| Description |
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