Product Attribute | Attribute Value |
PPAP | Unknown |
EU RoHS | Compliant |
Mounting | Surface Mount |
DRAM Type | Mobile LPDDR2 SDRAM |
ECCN (US) | EAR99 |
Packaging | Dry |
Pin Count | 134 |
Automotive | Unknown |
Lead Shape | Ball |
PCB changed | 134 |
Part Status | Active |
Organization | 64Mx16 |
Package Width | 10 |
Interface Type | HSUL |
Package Height | 0.58(Min) |
Package Length | 11.5 |
Supplier Package | FBGA |
Chip Density (bit) | 1G |
Data Bus Width (bit) | 16 |
Standard Package Name | BGA |
Operating Current (mA) | 155 |
Address Bus Width (bit) | 13 |
Maximum Access Time (ns) | 5.5 |
Maximum Clock Rate (MHz) | 533 |
Number of Internal Banks | 8 |
Number of Words per Bank | 8M |
Number of Bits/Word (bit) | 16 |
Number of I/O Lines (bit) | 16 |
Supplier Temperature Grade | Automotive |
Maximum Operating Temperature (°C) | 125 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Supply Voltage (V) | 1.3|1.95 |
Minimum Operating Supply Voltage (V) | 1.14|1.7 |
Typical Operating Supply Voltage (V) | 1.2|1.8 |
Description |