Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
DRAM Type | Mobile LPDDR2 SDRAM |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 134 |
Automotive | No |
Lead Shape | Ball |
PCB changed | 134 |
Part Status | Obsolete |
Organization | 16Mx32 |
Package Width | 10 |
Interface Type | HSUL |
Package Height | 0.58(Min) |
Package Length | 11.5 |
Supplier Package | VFBGA |
Chip Density (bit) | 512M |
Process Technology | CMOS |
Data Bus Width (bit) | 32 |
Standard Package Name | BGA |
Operating Current (mA) | 200 |
Address Bus Width (bit) | 13 |
Maximum Clock Rate (MHz) | 533 |
Number of Internal Banks | 4 |
Number of Words per Bank | 4M |
Number of Bits/Word (bit) | 32 |
Number of I/O Lines (bit) | 32 |
Maximum Operating Temperature (°C) | 85 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Supply Voltage (V) | 1.95|1.3 |
Minimum Operating Supply Voltage (V) | 1.14|1.7 |
Typical Operating Supply Voltage (V) | 1.2|1.8 |
Description |