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EDB5432BEBH-1DIT-F-R
EDB5432BEBH-1DIT-F-R
DRAM Chip EDB5432BEBH-1DIT-F-R
Micron Technology
EDB5432BEBH-1DIT-F-R
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Memory
DRAM Chip
Specification
Product AttributeAttribute Value
PPAPNo
EU RoHSCompliant
MountingSurface Mount
DRAM TypeMobile LPDDR2 SDRAM
ECCN (US)EAR99
PackagingTape and Reel
Pin Count134
AutomotiveNo
Lead ShapeBall
PCB changed134
Part StatusObsolete
Organization16Mx32
Package Width10
Interface TypeHSUL
Package Height0.58(Min)
Package Length11.5
Supplier PackageVFBGA
Chip Density (bit)512M
Process TechnologyCMOS
Data Bus Width (bit)32
Standard Package NameBGA
Operating Current (mA)200
Address Bus Width (bit)13
Maximum Clock Rate (MHz)533
Number of Internal Banks4
Number of Words per Bank4M
Number of Bits/Word (bit)32
Number of I/O Lines (bit)32
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)-40
Maximum Operating Supply Voltage (V)1.95|1.3
Minimum Operating Supply Voltage (V)1.14|1.7
Typical Operating Supply Voltage (V)1.2|1.8
Description
DRAM Chip Mobile LPDDR2 SDRAM 512Mbit 16Mx32 1.2V/1.8V 134-Pin VFBGA T/R
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