Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
DRAM Type | Mobile LPDDR3 SDRAM |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 253 |
Automotive | No |
Lead Shape | Ball |
PCB changed | 253 |
Part Status | Obsolete |
Organization | 128Mx64 |
Package Width | 12.5 |
Interface Type | HSUL_12 |
Package Height | 0.58 |
Package Length | 12.5 |
Supplier Package | FBGA |
Chip Density (bit) | 8G |
Data Bus Width (bit) | 64 |
Standard Package Name | BGA |
Operating Current (mA) | 480 |
Address Bus Width (bit) | 17 |
Maximum Access Time (ns) | 5.5 |
Maximum Clock Rate (MHz) | 1600 |
Number of Internal Banks | 8 |
Number of Words per Bank | 16M |
Number of Bits/Word (bit) | 64 |
Number of I/O Lines (bit) | 64 |
Maximum Operating Temperature (°C) | 85 |
Minimum Operating Temperature (°C) | -30 |
Maximum Operating Supply Voltage (V) | 1.3|1.95 |
Minimum Operating Supply Voltage (V) | 1.14|1.7 |
Typical Operating Supply Voltage (V) | 1.2|1.8 |
Description |