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EDF8164A1MA-GD-F-R
EDF8164A1MA-GD-F-R
DRAM Chip EDF8164A1MA-GD-F-R
Micron Technology
EDF8164A1MA-GD-F-R
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Memory
DRAM Chip
Specification
Product AttributeAttribute Value
PPAPNo
EU RoHSCompliant
MountingSurface Mount
DRAM TypeMobile LPDDR3 SDRAM
ECCN (US)EAR99
PackagingTape and Reel
Pin Count253
AutomotiveNo
Lead ShapeBall
PCB changed253
Part StatusObsolete
Organization128Mx64
Package Width12.5
Interface TypeHSUL_12
Package Height0.58
Package Length12.5
Supplier PackageFBGA
Chip Density (bit)8G
Data Bus Width (bit)64
Standard Package NameBGA
Operating Current (mA)480
Address Bus Width (bit)17
Maximum Access Time (ns)5.5
Maximum Clock Rate (MHz)1600
Number of Internal Banks8
Number of Words per Bank16M
Number of Bits/Word (bit)64
Number of I/O Lines (bit)64
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)-30
Maximum Operating Supply Voltage (V)1.3|1.95
Minimum Operating Supply Voltage (V)1.14|1.7
Typical Operating Supply Voltage (V)1.2|1.8
Description
DRAM Chip Mobile LPDDR3 SDRAM 8Gbit 128Mx64 1.2V/1.8V 253-Pin FBGA T/R
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