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K3RG3G30MM-MGCH
K3RG3G30MM-MGCH
DRAM Chip K3RG3G30MM-MGCH
Samsung Electronics
K3RG3G30MM-MGCH
--
Memory
DRAM Chip
Specification
Product AttributeAttribute Value
PPAPNo
EU RoHSSupplier Unconfirmed
MountingSurface Mount
ECCN (US)EAR99
Pin Count366
AutomotiveNo
Lead ShapeBall
PCB changed366
Part StatusActive
Supplier PackageFBGA
Standard Package NameBGA
Description
M-DIE LOW POWER DDR4 DRAM 24GB DENSITY
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