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K4A8G045WB-BCRC
K4A8G045WB-BCRC
DRAM Chip K4A8G045WB-BCRC
Samsung Electronics
K4A8G045WB-BCRC
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Memory
DRAM Chip
Specification
Product AttributeAttribute Value
HTS8542.32.00.36
PPAPNo
EU RoHSCompliant
MountingSurface Mount
DRAM TypeDDR4 SDRAM
ECCN (US)EAR99
Pin Count78
AutomotiveNo
Lead ShapeBall
PCB changed78
Part StatusActive
Organization2Gx4
Package Width7.5
Interface TypePOD
Package Height0.73
Package Length11
Supplier PackageFBGA
Chip Density (bit)8G
Data Bus Width (bit)4
Standard Package NameBGA
Operating Current (mA)93
Address Bus Width (bit)19
Maximum Access Time (ns)0.175
Maximum Clock Rate (MHz)2400
Number of Internal Banks16
Number of Words per Bank128M
Number of Bits/Word (bit)4
Number of I/O Lines (bit)4
Supplier Temperature GradeCommercial
Maximum Operating Temperature (°C)95
Minimum Operating Temperature (°C)0
Maximum Operating Supply Voltage (V)1.26
Minimum Operating Supply Voltage (V)1.14
Typical Operating Supply Voltage (V)1.2
Description
DRAM Chip DDR4 SDRAM 8Gbit 2Gx4 1.2V 78-Pin FBGA
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