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DRAM Chip K4B2G0846D-HCH9T00
Samsung Electronics
K4B2G0846D-HCH9T00
--
Memory
DRAM Chip
Specification
Product AttributeAttribute Value
HTS8542.32.00.36
PPAPNo
EU RoHSCompliant
DRAM TypeDDR3 SDRAM
ECCN (US)EAR99
AutomotiveNo
Part StatusObsolete
Organization256Mx8
Interface TypeSSTL_1.5
Chip Density (bit)2G
Data Bus Width (bit)8
Operating Current (mA)80
Address Bus Width (bit)18
Maximum Access Time (ns)0.255
Maximum Clock Rate (MHz)1333
Number of Internal Banks8
Number of Words per Bank32M
Number of Bits/Word (bit)8
Number of I/O Lines (bit)8
Maximum Operating Temperature (°C)95
Minimum Operating Temperature (°C)0
Maximum Operating Supply Voltage (V)1.575
Minimum Operating Supply Voltage (V)1.425
Typical Operating Supply Voltage (V)1.5
Description
DRAM Chip DDR3 SDRAM 2Gbit 256Mx8 1.5V 78-Pin FBGA
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