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DRAM Chip K4B2G1646B-HCF7000
Samsung Electronics
K4B2G1646B-HCF7000
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Memory
DRAM Chip
Specification
| Product Attribute | Attribute Value |
| PPAP | No |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| DRAM Type | DDR3 SDRAM |
| ECCN (US) | EAR99 |
| Pin Count | 96 |
| Automotive | No |
| Lead Shape | Ball |
| PCB changed | 96 |
| Part Status | Obsolete |
| Organization | 128Mx16 |
| Package Width | 9 |
| Interface Type | SSTL_1.5 |
| Package Height | 0.75 |
| Package Length | 13.3 |
| Supplier Package | FBGA |
| Chip Density (bit) | 2G |
| Data Bus Width (bit) | 16 |
| Standard Package Name | BGA |
| Operating Current (mA) | 155 |
| Address Bus Width (bit) | 17 |
| Maximum Access Time (ns) | 20 |
| Maximum Clock Rate (MHz) | 800 |
| Number of Internal Banks | 8 |
| Number of Words per Bank | 16M |
| Number of Bits/Word (bit) | 16 |
| Number of I/O Lines (bit) | 16 |
| Maximum Operating Temperature (°C) | 95 |
| Minimum Operating Temperature (°C) | 0 |
| Maximum Operating Supply Voltage (V) | 1.575 |
| Minimum Operating Supply Voltage (V) | 1.425 |
| Typical Operating Supply Voltage (V) | 1.5 |
| Description |
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