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K4B4G0846E-BMMA
K4B4G0846E-BMMA
DRAM Chip K4B4G0846E-BMMA
Samsung Electronics
K4B4G0846E-BMMA
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Memory
DRAM Chip
Specification
Product AttributeAttribute Value
PPAPNo
EU RoHSCompliant
MountingSurface Mount
DRAM TypeDDR3L SDRAM
ECCN (US)EAR99
Pin Count78
AutomotiveNo
PCB changed78
Part StatusActive
Organization512Mx8
Package Width7.5
Package Length11
Supplier PackageFBGA
Chip Density (bit)4G
Data Bus Width (bit)8
Operating Current (mA)80
Address Bus Width (bit)19
Maximum Access Time (ns)0.195
Maximum Clock Rate (MHz)1866
Number of Internal Banks8
Number of Words per Bank64M
Number of Bits/Word (bit)8
Number of I/O Lines (bit)8
Supplier Temperature GradeIndustrial
Maximum Operating Temperature (°C)95
Minimum Operating Temperature (°C)-40
Maximum Operating Supply Voltage (V)1.575|1.45
Minimum Operating Supply Voltage (V)1.425|1.283
Typical Operating Supply Voltage (V)1.5|1.35
Description
DRAM Chip DDR3L SDRAM 4Gbit 512Mx8 1.35V/1.5V 78-Pin FBGA
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