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K4E6E304EC-EGCG
K4E6E304EC-EGCG
DRAM Chip K4E6E304EC-EGCG
Samsung Electronics
K4E6E304EC-EGCG
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Memory
DRAM Chip
Specification
Product AttributeAttribute Value
HTS8542.32.00.36
PPAPNo
EU RoHSCompliant
MountingSurface Mount
DRAM TypeMobile LPDDR3 SDRAM
ECCN (US)EAR99
Pin Count178
AutomotiveNo
PCB changed178
Part StatusActive
Organization512Mx32
Supplier PackageFBGA
Chip Density (bit)16G
Data Bus Width (bit)32
Maximum Clock Rate (MHz)2133
Number of Bits/Word (bit)32
Number of I/O Lines (bit)32
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)-25
Typical Operating Supply Voltage (V)1.2|1.8
Description
DRAM Chip Mobile LPDDR3 SDRAM 16Gbit 512Mx32 1.2V/1.8V 178-Pin FBGA
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