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DRAM Chip K4E8E324EB-AGCF
Samsung Electronics
K4E8E324EB-AGCF
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Memory
DRAM Chip
Specification
Product AttributeAttribute Value
PPAPNo
EU RoHSSupplier Unconfirmed
MountingSurface Mount
DRAM TypeMobile LPDDR3 SDRAM
ECCN (US)EAR99
Pin Count168
AutomotiveNo
PCB changed168
Part StatusUnconfirmed
Organization256Mx32
Supplier PackageFBGA
Chip Density (bit)8G
Data Bus Width (bit)32
Number of Bits/Word (bit)32
Typical Operating Supply Voltage (V)1.2|1.8
Description
DRAM Chip Mobile LPDDR3 SDRAM 8Gbit 256Mx32 1.2V/1.2V/1.8V 168-Pin FBGA
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