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K4FBE3D4HM-GFCL
K4FBE3D4HM-GFCL
DRAM Chip K4FBE3D4HM-GFCL
Samsung Electronics
K4FBE3D4HM-GFCL
--
Memory
DRAM Chip
Specification
Product AttributeAttribute Value
PPAPNo
EU RoHSSupplier Unconfirmed
MountingSurface Mount
DRAM TypeMobile LPDDR4 SDRAM
ECCN (US)EAR99
Pin Count200
AutomotiveNo
PCB changed200
Part StatusActive
Organization1Gx32
Supplier PackageFBGA
Chip Density (bit)32G
Data Bus Width (bit)32
Maximum Clock Rate (MHz)4266
Number of Bits/Word (bit)32
Number of I/O Lines (bit)32
Maximum Operating Temperature (°C)95
Minimum Operating Temperature (°C)-40
Typical Operating Supply Voltage (V)1.8|1.1
Description
DRAM Chip Mobile LPDDR4 SDRAM 32Gbit 1Gx32 1.1V/1.8V 200-Pin FBGA
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