Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
DRAM Type | Mobile SDRAM |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 54 |
Automotive | No |
Lead Shape | Ball |
PCB changed | 54 |
Part Status | Obsolete |
Organization | 4Mx16 |
Package Width | 8 |
Interface Type | LVCMOS |
Package Height | 1(Max) - 0.25(Min) |
Package Length | 8 |
Supplier Package | FBGA |
Chip Density (bit) | 64M |
Data Bus Width (bit) | 16 |
Standard Package Name | BGA |
Operating Current (mA) | 80 |
Address Bus Width (bit) | 14 |
Maximum Access Time (ns) | 5.4|7 |
Maximum Clock Rate (MHz) | 133 |
Number of Internal Banks | 4 |
Number of Words per Bank | 1M |
Number of Bits/Word (bit) | 16 |
Number of I/O Lines (bit) | 16 |
Supplier Temperature Grade | Extended |
Maximum Operating Temperature (°C) | 85 |
Minimum Operating Temperature (°C) | -25 |
Maximum Operating Supply Voltage (V) | 3.6 |
Minimum Operating Supply Voltage (V) | 2.7 |
Typical Operating Supply Voltage (V) | 3 |
Description |