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K4S281632I-UC60T00
K4S281632I-UC60T00
DRAM Chip K4S281632I-UC60T00
Samsung Electronics
K4S281632I-UC60T00
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Memory
DRAM Chip
Specification
Product AttributeAttribute Value
PPAPNo
EU RoHSCompliant
MountingSurface Mount
DRAM TypeSDRAM
ECCN (US)EAR99
Pin Count54
AutomotiveNo
Lead ShapeGull-wing
PCB changed54
Part StatusObsolete
Organization8Mx16
Package Width10.16
Interface TypeLVTTL
Package Height1
Package Length22.62(Max)
Supplier PackageTSOP-II
Chip Density (bit)128M
Data Bus Width (bit)16
Standard Package NameSOP
Operating Current (mA)150
Address Bus Width (bit)14
Maximum Access Time (ns)5
Maximum Clock Rate (MHz)166
Number of Internal Banks4
Number of Words per Bank2M
Number of Bits/Word (bit)16
Number of I/O Lines (bit)16
Supplier Temperature GradeCommercial
Maximum Operating Temperature (°C)70
Minimum Operating Temperature (°C)0
Maximum Operating Supply Voltage (V)3.6
Minimum Operating Supply Voltage (V)3
Typical Operating Supply Voltage (V)3.3
Description
DRAM Chip SDRAM 128Mbit 8Mx16 3.3V 54-Pin TSOP-II
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