Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
DRAM Type | Mobile-DDR SDRAM |
ECCN (US) | EAR99 |
Packaging | Tray |
Pin Count | 90 |
Automotive | No |
Lead Shape | Ball |
PCB changed | 90 |
Part Status | Obsolete |
Organization | 8Mx32 |
Package Width | 8 |
Interface Type | LVCMOS |
Package Height | 1(Max) - 0.25(Min) |
Package Length | 13 |
Supplier Package | FBGA |
Chip Density (bit) | 256M |
Data Bus Width (bit) | 32 |
Standard Package Name | BGA |
Operating Current (mA) | 110 |
Address Bus Width (bit) | 14 |
Maximum Access Time (ns) | 6|8 |
Maximum Clock Rate (MHz) | 266 |
Number of Internal Banks | 4 |
Number of Words per Bank | 2M |
Number of Bits/Word (bit) | 32 |
Number of I/O Lines (bit) | 32 |
Supplier Temperature Grade | Extended |
Maximum Operating Temperature (°C) | 85 |
Minimum Operating Temperature (°C) | -25 |
Maximum Operating Supply Voltage (V) | 1.95 |
Minimum Operating Supply Voltage (V) | 1.7 |
Typical Operating Supply Voltage (V) | 1.8 |
Description |