Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
DRAM Type | DDR3L SDRAM |
ECCN (US) | EAR99 |
Pin Count | 136 |
Automotive | No |
Lead Shape | Ball |
PCB changed | 136 |
Part Status | Obsolete |
Organization | 256Mx32 |
Package Width | 10 |
Interface Type | CMOS |
Package Height | 0.75(Min) |
Package Length | 14 |
Supplier Package | FBGA |
Chip Density (bit) | 8G |
Process Technology | CMOS |
Data Bus Width (bit) | 32 |
Standard Package Name | BGA |
Operating Current (mA) | 470 |
Address Bus Width (bit) | 18 |
Maximum Clock Rate (MHz) | 1600 |
Number of Internal Banks | 8 |
Number of Words per Bank | 32M |
Number of Bits/Word (bit) | 32 |
Number of I/O Lines (bit) | 32 |
Supplier Temperature Grade | Industrial |
Maximum Operating Temperature (°C) | 95 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Supply Voltage (V) | 1.45 |
Minimum Operating Supply Voltage (V) | 1.283 |
Typical Operating Supply Voltage (V) | 1.35 |
Description |