Product Attribute | Attribute Value |
HTS | 8542.32.00.02 |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
DRAM Type | DDR3L SDRAM |
ECCN (US) | EAR99 |
Pin Count | 78 |
Automotive | No |
Lead Shape | Ball |
PCB changed | 78 |
Part Status | Active |
Organization | 512Mx8 |
Package Width | 8 |
Package Height | 0.87(Min) |
Package Length | 10.5 |
Supplier Package | FBGA |
Chip Density (bit) | 4G |
Process Technology | CMOS |
Data Bus Width (bit) | 8 |
Standard Package Name | BGA |
Operating Current (mA) | 110 |
Address Bus Width (bit) | 19 |
Maximum Access Time (ns) | 0.18 |
Maximum Clock Rate (MHz) | 2133 |
Number of Internal Banks | 8 |
Number of Words per Bank | 64M |
Number of Bits/Word (bit) | 8 |
Number of I/O Lines (bit) | 8 |
Supplier Temperature Grade | Commercial |
Maximum Operating Temperature (°C) | 95 |
Minimum Operating Temperature (°C) | 0 |
Maximum Operating Supply Voltage (V) | 1.45 |
Minimum Operating Supply Voltage (V) | 1.283 |
Typical Operating Supply Voltage (V) | 1.35 |
Description |