Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
DRAM Type | DDR3L SDRAM |
ECCN (US) | EAR99 |
Packaging | Tray |
Pin Count | 78 |
Automotive | No |
Lead Shape | Ball |
PCB changed | 78 |
Part Status | Obsolete |
Organization | 512Mx8 |
Package Width | 9 |
Package Height | 1.26 - 0.25(Min) |
Package Length | 10.5 |
Supplier Package | FBGA |
Chip Density (bit) | 4G |
Process Technology | CMOS |
Data Bus Width (bit) | 8 |
Standard Package Name | BGA |
Operating Current (mA) | 157 |
Address Bus Width (bit) | 19 |
Maximum Access Time (ns) | 0.225 |
Maximum Clock Rate (MHz) | 1600 |
Number of Internal Banks | 8 |
Number of Words per Bank | 64M |
Number of Bits/Word (bit) | 8 |
Number of I/O Lines (bit) | 8 |
Supplier Temperature Grade | Industrial |
Maximum Operating Temperature (°C) | 95 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Supply Voltage (V) | 1.45 |
Minimum Operating Supply Voltage (V) | 1.283 |
Typical Operating Supply Voltage (V) | 1.35 |
Description |