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MT42L64M64D2LL-18 IT:C
MT42L64M64D2LL-18 IT:C
DRAM Chip MT42L64M64D2LL-18 IT:C
Micron Technology
MT42L64M64D2LL-18 IT:C
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Memory
DRAM Chip
Specification
Product AttributeAttribute Value
PPAPNo
EU RoHSCompliant
MountingSurface Mount
DRAM TypeMobile LPDDR2 SDRAM
ECCN (US)EAR99
PackagingTray
Pin Count216
AutomotiveNo
Lead ShapeBall
PCB changed216
Part StatusObsolete
Organization64Mx64
Package Width12
Interface TypeHDUL_12
Package Height0.47(Min)
Package Length12
Supplier PackageFBGA
Chip Density (bit)4G
Data Bus Width (bit)64
Standard Package NameBGA
Operating Current (mA)220
Address Bus Width (bit)14
Maximum Clock Rate (MHz)533
Number of Internal Banks8
Number of Words per Bank8M
Number of Bits/Word (bit)64
Number of I/O Lines (bit)64
Supplier Temperature GradeIndustrial
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)-40
Maximum Operating Supply Voltage (V)1.3|1.95
Minimum Operating Supply Voltage (V)1.14|1.7
Typical Operating Supply Voltage (V)1.2|1.8
Description
DRAM Chip Mobile LPDDR2 SDRAM 4Gbit 64Mx64 1.2V/1.8V 216-Pin FBGA Tray
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