Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
DRAM Type | Mobile LPDDR SDRAM |
ECCN (US) | EAR99 |
Pin Count | 168 |
Automotive | No |
Lead Shape | Ball |
PCB changed | 168 |
Part Status | Obsolete |
Organization | 256Mx32 |
Package Width | 12 |
Interface Type | LVCMOS |
Package Height | 0.59(Min) |
Package Length | 12 |
Supplier Package | VFBGA |
Chip Density (bit) | 8G |
Data Bus Width (bit) | 32 |
Standard Package Name | BGA |
Maximum Access Time (ns) | 6.5|5 |
Maximum Clock Rate (MHz) | 200 |
Number of Internal Banks | 4 |
Number of Words per Bank | 64M |
Number of Bits/Word (bit) | 32 |
Number of I/O Lines (bit) | 32 |
Supplier Temperature Grade | Industrial |
Maximum Operating Temperature (°C) | 85 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Supply Voltage (V) | 1.95 |
Minimum Operating Supply Voltage (V) | 1.7 |
Typical Operating Supply Voltage (V) | 1.8 |
Description |