Product Attribute | Attribute Value |
HTS | 8542.32.00.71 |
PPAP | Yes |
EU RoHS | Compliant |
Mounting | Surface Mount |
DRAM Type | DDR2 SDRAM |
ECCN (US) | EAR99 |
Pin Count | 84 |
Automotive | Yes |
Lead Shape | Ball |
PCB changed | 84 |
Part Status | Obsolete |
Organization | 64Mx16 |
Package Width | 8 |
Interface Type | SSTL_18 |
Package Height | 0.8 |
Package Length | 12.5 |
Supplier Package | FBGA |
Chip Density (bit) | 1G |
Process Technology | CMOS |
Data Bus Width (bit) | 16 |
Standard Package Name | BGA |
Operating Current (mA) | 160 |
Address Bus Width (bit) | 16 |
Maximum Access Time (ns) | 0.4 |
Maximum Clock Rate (MHz) | 800 |
Number of Internal Banks | 8 |
Number of Words per Bank | 8M |
Number of Bits/Word (bit) | 16 |
Number of I/O Lines (bit) | 16 |
Supplier Temperature Grade | Automotive |
Maximum Operating Temperature (°C) | 105 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Supply Voltage (V) | 1.9 |
Minimum Operating Supply Voltage (V) | 1.7 |
Typical Operating Supply Voltage (V) | 1.8 |
Description |