Product Attribute | Attribute Value |
HTS | 8542.32.00.28 |
PPAP | No |
EU RoHS | Compliant |
Mounting | Surface Mount |
DRAM Type | Mobile LPSDR SDRAM |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 54 |
Automotive | No |
Lead Shape | Ball |
PCB changed | 54 |
Part Status | Obsolete |
Organization | 32Mx16 |
Package Width | 8 |
Interface Type | LVTTL |
Package Height | 0.65 |
Package Length | 9 |
Supplier Package | VFBGA |
Chip Density (bit) | 512M |
Process Technology | CMOS |
Data Bus Width (bit) | 16 |
Standard Package Name | BGA |
Operating Current (mA) | 90 |
Address Bus Width (bit) | 15 |
Maximum Access Time (ns) | 5.4|8 |
Maximum Clock Rate (MHz) | 133 |
Number of Internal Banks | 4 |
Number of Words per Bank | 8M |
Number of Bits/Word (bit) | 16 |
Number of I/O Lines (bit) | 16 |
Supplier Temperature Grade | Commercial |
Maximum Operating Temperature (°C) | 70 |
Minimum Operating Temperature (°C) | 0 |
Maximum Operating Supply Voltage (V) | 1.95 |
Minimum Operating Supply Voltage (V) | 1.7 |
Typical Operating Supply Voltage (V) | 1.8 |
Description |