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MT48H8M16LFB4-75 IT:K TR
MT48H8M16LFB4-75 IT:K TR
DRAM Chip MT48H8M16LFB4-75 IT:K TR
Micron Technology
MT48H8M16LFB4-75 IT:K TR
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Memory
DRAM Chip
Specification
Product AttributeAttribute Value
PPAPNo
EU RoHSCompliant
MountingSurface Mount
DRAM TypeMobile SDRAM
ECCN (US)EAR99
PackagingTape and Reel
Pin Count54
AutomotiveNo
Lead ShapeBall
PCB changed54
Part StatusObsolete
Organization8Mx16
Package Width8
Interface TypeLVTTL
Package Height0.65
Package Length8
Supplier PackageVFBGA
Chip Density (bit)128M
Data Bus Width (bit)16
Standard Package NameBGA
Operating Current (mA)70
Address Bus Width (bit)14
Maximum Access Time (ns)8|5.4
Maximum Clock Rate (MHz)133
Number of Internal Banks4
Number of Words per Bank2M
Number of Bits/Word (bit)16
Number of I/O Lines (bit)16
Supplier Temperature GradeIndustrial
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)-40
Maximum Operating Supply Voltage (V)1.95
Minimum Operating Supply Voltage (V)1.7
Typical Operating Supply Voltage (V)1.8
Description
DRAM Chip Mobile SDRAM 128Mbit 8Mx16 1.8V 54-Pin VFBGA T/R
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