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MT48LC2M32B2P-55:G TR
MT48LC2M32B2P-55:G TR
DRAM Chip MT48LC2M32B2P-55:G TR
Micron Technology
MT48LC2M32B2P-55:G TR
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Memory
DRAM Chip
Specification
Product AttributeAttribute Value
PPAPNo
EU RoHSCompliant
MountingSurface Mount
DRAM TypeSDR SDRAM
ECCN (US)EAR99
PackagingTape and Reel
Pin Count86
AutomotiveNo
Lead ShapeGull-wing
PCB changed86
Part StatusObsolete
Organization2Mx32
Package Width10.16
Interface TypeLVTTL
Package Height1(Max)
Package Length22.22
Supplier PackageTSOP-II
Chip Density (bit)64M
Process TechnologyCMOS
Data Bus Width (bit)32
Standard Package NameSOP
Operating Current (mA)260
Address Bus Width (bit)13
Maximum Access Time (ns)5
Maximum Clock Rate (MHz)183
Number of Internal Banks4
Number of Words per Bank512K
Number of Bits/Word (bit)32
Number of I/O Lines (bit)32
Supplier Temperature GradeCommercial
Maximum Operating Temperature (°C)70
Minimum Operating Temperature (°C)0
Maximum Operating Supply Voltage (V)3.6
Minimum Operating Supply Voltage (V)3
Typical Operating Supply Voltage (V)3.3
Description
DRAM Chip SDR SDRAM 64Mbit 2Mx32 3.3V 86-Pin TSOP-II T/R
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