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MT48LC8M32B2B5-6
MT48LC8M32B2B5-6
DRAM Chip MT48LC8M32B2B5-6
Micron Technology
MT48LC8M32B2B5-6
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Memory
DRAM Chip
Specification
Product AttributeAttribute Value
PPAPNo
EU RoHSCompliant
MountingSurface Mount
DRAM TypeSDRAM
ECCN (US)EAR99
PackagingTray
Pin Count90
AutomotiveNo
Lead ShapeBall
PCB changed90
Part StatusObsolete
Organization8Mx32
Package Width8
Interface TypeLVTTL
Package Height0.65
Package Length13
Supplier PackageFBGA
Chip Density (bit)256M
Process TechnologyCMOS
Data Bus Width (bit)32
Standard Package NameBGA
Operating Current (mA)165
Address Bus Width (bit)14
Maximum Access Time (ns)7.5|5.5|17
Maximum Clock Rate (MHz)166
Number of Internal Banks4
Number of Words per Bank2M
Number of Bits/Word (bit)32
Number of I/O Lines (bit)32
Supplier Temperature GradeCommercial
Maximum Operating Temperature (°C)70
Minimum Operating Temperature (°C)0
Maximum Operating Supply Voltage (V)3.6
Minimum Operating Supply Voltage (V)3
Typical Operating Supply Voltage (V)3.3
Description
DRAM Chip SDRAM 256Mbit 8Mx32 3.3V 90-Pin FBGA Tray
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