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MT48LC8M32B2TG-6
MT48LC8M32B2TG-6
DRAM Chip MT48LC8M32B2TG-6
Micron Technology
MT48LC8M32B2TG-6
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Memory
DRAM Chip
Specification
Product AttributeAttribute Value
PPAPNo
EU RoHSNot Compliant
MountingSurface Mount
DRAM TypeSDRAM
ECCN (US)EAR99
PackagingTray
Pin Count86
AutomotiveNo
Lead ShapeGull-wing
PCB changed86
Part StatusObsolete
Organization8Mx32
Package Width10.16
Interface TypeLVTTL
Package Height1(Max)
Package Length22.22
Supplier PackageTSOP
Chip Density (bit)256M
Process TechnologyCMOS
Data Bus Width (bit)32
Standard Package NameSOP
Operating Current (mA)165
Address Bus Width (bit)14
Maximum Access Time (ns)17|7.5|5.5
Maximum Clock Rate (MHz)166
Number of Internal Banks4
Number of Words per Bank2M
Number of Bits/Word (bit)32
Number of I/O Lines (bit)32
Supplier Temperature GradeCommercial
Maximum Operating Temperature (°C)70
Minimum Operating Temperature (°C)0
Maximum Operating Supply Voltage (V)3.6
Minimum Operating Supply Voltage (V)3
Typical Operating Supply Voltage (V)3.3
Description
DRAM Chip SDRAM 256Mbit 8Mx32 3.3V 86-Pin TSOP Tray
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