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MT49H32M9FM-33:B
MT49H32M9FM-33:B
DRAM Chip MT49H32M9FM-33:B
Micron Technology
MT49H32M9FM-33:B
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Memory
DRAM Chip
Specification
Product AttributeAttribute Value
PPAPNo
EU RoHSNot Compliant
MountingSurface Mount
DRAM TypeRLDRAM
ECCN (US)EAR99
PackagingTray
Pin Count144
AutomotiveNo
PCB changed144
Part StatusObsolete
Organization32Mx9
Package Width11
Interface TypeHSTL
Package Height1.2(Max) - 0.34(Min)
Package Length18.5
Supplier PackageMBGA
Chip Density (bit)288M
Data Bus Width (bit)9
Standard Package NameBGA
Address Bus Width (bit)24
Maximum Clock Rate (MHz)300
Number of Internal Banks8
Number of Words per Bank4M
Number of Bits/Word (bit)9
Number of I/O Lines (bit)9
Supplier Temperature GradeCommercial
Maximum Operating Temperature (°C)95
Minimum Operating Temperature (°C)0
Maximum Operating Supply Voltage (V)1.9
Minimum Operating Supply Voltage (V)1.7
Typical Operating Supply Voltage (V)1.8
Description
DRAM Chip RLDRAM 288Mbit 32Mx9 1.8V 144-Pin MBGA Tray
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