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MT49H8M36HTTI
MT49H8M36HTTI
DRAM Chip MT49H8M36HTTI
Micron Technology
MT49H8M36HTTI
--
Memory
DRAM Chip
Specification
Product AttributeAttribute Value
PPAPNo
EU RoHSCompliant
MountingSurface Mount
DRAM TypeRLDRAM
ECCN (US)EAR99
PackagingTray
Pin Count144
AutomotiveNo
Lead ShapeBall
PCB changed144
Part StatusObsolete
Organization8Mx36
Package Width11
Interface TypeHSTL
Package Height0.75
Package Length18.5
Supplier PackageFBGA
Chip Density (bit)288M
Data Bus Width (bit)36
Standard Package NameBGA
Address Bus Width (bit)22
Number of Internal Banks8
Number of Words per Bank1M
Number of Bits/Word (bit)36
Number of I/O Lines (bit)36
Supplier Temperature GradeIndustrial
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)-40
Maximum Operating Supply Voltage (V)1.9
Minimum Operating Supply Voltage (V)1.7
Typical Operating Supply Voltage (V)1.8
Description
DRAM Chip RLDRAM 288Mbit 8Mx36 1.8V 144-Pin FBGA Tray
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