Product Attribute | Attribute Value |
HTS | 8542.32.00.02 |
PPAP | Yes |
EU RoHS | Compliant |
Mounting | Surface Mount |
DRAM Type | DDR SDRAM |
ECCN (US) | EAR99 |
Packaging | Tray |
Pin Count | 24 |
Automotive | Yes |
Lead Shape | Ball |
PCB changed | 24 |
Part Status | LTB |
Organization | 8Mx8 |
Package Width | 6 |
Package Height | 1(Max) - 0.2(Min) |
Package Length | 8 |
Supplier Package | Fortified BGA |
Chip Density (bit) | 64M |
Process Technology | 63nm |
Data Bus Width (bit) | 8 |
Standard Package Name | BGA |
Operating Current (mA) | 60 |
Maximum Access Time (ns) | 36(Min) |
Maximum Clock Rate (MHz) | 166 |
Number of Bits/Word (bit) | 8 |
Number of I/O Lines (bit) | 8 |
Supplier Temperature Grade | Automotive |
Maximum Operating Temperature (°C) | 85 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Supply Voltage (V) | 1.95 |
Minimum Operating Supply Voltage (V) | 1.7 |
Typical Operating Supply Voltage (V) | 1.8 |
Description |