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S70KL1281DABHV023
S70KL1281DABHV023
DRAM Chip S70KL1281DABHV023
Cypress
S70KL1281DABHV023
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Memory
DRAM Chip
Specification
Product AttributeAttribute Value
PPAPNo
EU RoHSCompliant
MountingSurface Mount
DRAM TypeDDR SDRAM
ECCN (US)3A991.b.2
PackagingTape and Reel
Pin Count24
AutomotiveNo
Lead ShapeBall
PCB changed24
Part StatusLTB
Organization16Mx8
Package Width6
Package Height1(Max) - 0.2(Min)
Package Length8
Supplier PackageFortified BGA
Chip Density (bit)128M
Process Technology63nm
Data Bus Width (bit)8
Standard Package NameBGA
Operating Current (mA)72
Maximum Access Time (ns)40(Min)
Maximum Clock Rate (MHz)100
Number of Bits/Word (bit)8
Number of I/O Lines (bit)8
Supplier Temperature GradeIndustrial Plus
Maximum Operating Temperature (°C)105
Minimum Operating Temperature (°C)-40
Maximum Operating Supply Voltage (V)3.6
Minimum Operating Supply Voltage (V)2.7
Typical Operating Supply Voltage (V)3|3.3
Description
DRAM Chip DDR SDRAM 128Mbit 16Mx8 3V/3.3V 24-Pin Fortified BGA T/R
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