Product Attribute | Attribute Value |
PPAP | No |
EU RoHS | Not Compliant |
Mounting | Surface Mount |
Polarity | Non-Inverting |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 6 |
Automotive | No |
Lead Shape | Ball |
Output Type | 3-State |
PCB changed | 6 |
Part Status | Obsolete |
Logic Family | LVC |
Package Width | 0.9 |
Logic Function | Demultiplexer |
Package Height | 0.35 |
Package Length | 1.4 |
Supplier Package | DSBGA |
Tolerant I/Os (V) | 5.5 Inputs |
Process Technology | CMOS |
Standard Package Name | BGA |
Number of Element Inputs | 1 |
Demultiplexing Capability | 1-of-2 |
Number of Element Outputs | 2 |
Supplier Temperature Grade | Commercial |
Number of Elements per Chip | 1 |
Maximum Quiescent Current (mA) | 0.01 |
Maximum Operating Temperature (°C) | 85 |
Minimum Operating Temperature (°C) | -40 |
Number of Input Enables per Element | 1 |
Absolute Propagation Delay Time (ns) | 12.7 |
Maximum Operating Supply Voltage (V) | 5.5 |
Minimum Operating Supply Voltage (V) | 1.65 |
Number of Output Enables per Element | 0 |
Typical Operating Supply Voltage (V) | 1.8|2.5|3.3|5 |
Maximum Low Level Output Current (mA) | 32 |
Propagation Delay Test Condition (pF) | 50 |
Maximum High Level Output Current (mA) | -32 |
Maximum Propagation Delay Time @ Maximum CL (ns) | 4.2@3V to 3.6V|3.2@4.5V to 5.5V |
Description |