Product Attribute | Attribute Value |
HTS | 8542.39.00.01 |
PPAP | No |
Type | I2C |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tube |
Pin Count | 20 |
Automotive | No |
Lead Shape | Gull-wing |
PCB changed | 20 |
Part Status | Active |
Coupling Type | Magnetic Coupling |
Package Width | 5.3 |
Package Height | 1.75 |
Package Length | 7.2 |
Supplier Package | SSOP |
Process Technology | CMOS |
Standard Package Name | SOP |
Maximum Fall Time (ns) | 120 |
Forward/Reverse Channels | 2/2 |
Number of Channels per Chip | 2 |
Maximum Power Dissipation (mW) | 150 |
Minimum Isolation Voltage (Vrms) | 2500 |
Maximum Working Insulation Voltage | 560Vp |
Maximum Operating Temperature (°C) | 105 |
Maximum Pulse Width Distortion (ns) | 145 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Supply Voltage (V) | 5.5 |
Minimum Operating Supply Voltage (V) | 3 |
Typical Operating Supply Voltage (V) | 3.3|5 |
Minimum Common Mode Rejection (kV/us) | 25 |
Maximum Propagation Delay Time (tPHL) (ns) | 275 |
Maximum Propagation Delay Time (tPLH) (ns) | 130 |
Description |