Product Attribute | Attribute Value |
HTS | 8542.39.00.01 |
PPAP | No |
Type | LVDS |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 28 |
Automotive | No |
PCB changed | 28 |
Part Status | Active |
Coupling Type | Magnetic Coupling |
Package Width | 7.6(Max) |
Package Height | 2.4(Max) |
Package Length | 10.45(Max) |
Supplier Package | SOIC W |
Maximum Data Rate | 2.5Gbps(Min) |
Maximum Fall Time (ns) | 0.18 |
Maximum Rise Time (ns) | 0.18 |
Forward/Reverse Channels | 4/0 |
Supplier Temperature Grade | Industrial |
Number of Channels per Chip | 4 |
Maximum Power Dissipation (mW) | 2740 |
Minimum Isolation Voltage (Vrms) | 5700 |
Maximum Working Insulation Voltage | 849Vp |
Maximum Operating Temperature (°C) | 125 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Supply Voltage (V) | 1.9 |
Minimum Operating Supply Voltage (V) | 1.7 |
Typical Operating Supply Voltage (V) | 1.8 |
Minimum Common Mode Rejection (kV/us) | 40 |
Maximum Propagation Delay Time (tPHL) (ns) | 2.8 |
Maximum Propagation Delay Time (tPLH) (ns) | 2.8 |
Description |