Product Attribute | Attribute Value |
HTS | 8542.39.00.01 |
PPAP | Unknown |
Type | General Purpose |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 16 |
Automotive | Yes |
Lead Shape | Gull-wing |
Output Type | CMOS |
PCB changed | 16 |
Part Status | Unconfirmed |
Coupling Type | Magnetic Coupling |
Package Width | 7.6(Max) |
Package Height | 2.35(Max) |
Package Length | 10.5(Max) |
Supplier Package | SOIC W |
Maximum Data Rate | 1Mbps |
Standard Package Name | SOP |
Maximum Fall Time (ns) | 10(Typ) |
Maximum Rise Time (ns) | 10(Typ) |
Forward/Reverse Channels | 2/0 |
Minimum Pulse Width (ns) | 1000 |
Number of Channels per Chip | 2 |
Maximum Power Dissipation (mW) | 2780 |
Minimum Isolation Voltage (Vrms) | 5000 |
Maximum Working Insulation Voltage | 848Vp |
Maximum Operating Temperature (°C) | 125 |
Maximum Propagation Delay Skew (ns) | 100 |
Maximum Pulse Width Distortion (ns) | 40 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Supply Voltage (V) | 5.5 |
Minimum Operating Supply Voltage (V) | 3 |
Maximum Quiescent Supply Current (mA) | 1.8/1.6 |
Minimum Common Mode Rejection (kV/us) | 25 |
Maximum Propagation Delay Time (tPHL) (ns) | 150 |
Maximum Propagation Delay Time (tPLH) (ns) | 150 |
Description |