Product Attribute | Attribute Value |
HTS | 8542.39.00.01 |
PPAP | No |
Type | SPI |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Pin Count | 8 |
Automotive | No |
Lead Shape | Gull-wing |
Output Type | CMOS |
PCB changed | 8 |
Part Status | Active |
Coupling Type | Magnetic Coupling |
Package Width | 4(Max) |
Package Height | 1.5(Max) |
Package Length | 5(Max) |
Supplier Package | SOIC N |
Maximum Data Rate | 25Mbps |
Standard Package Name | SOP |
Maximum Fall Time (ns) | 2.5(Typ) |
Maximum Rise Time (ns) | 2.5(Typ) |
Minimum Pulse Width (ns) | 40 |
Number of Channels per Chip | 2 |
Maximum Power Dissipation (mW) | 1560 |
Minimum Isolation Voltage (Vrms) | 2500 |
Maximum Operating Temperature (°C) | 125 |
Maximum Propagation Delay Skew (ns) | 22 |
Maximum Pulse Width Distortion (ns) | 4 |
Minimum Operating Temperature (°C) | -55 |
Maximum Operating Supply Voltage (V) | 5.5 |
Minimum Operating Supply Voltage (V) | 3 |
Maximum Quiescent Supply Current (mA) | 0.8 |
Maximum Propagation Delay Time (tPHL) (ns) | 50 |
Maximum Propagation Delay Time (tPLH) (ns) | 50 |
Description |