Product Attribute | Attribute Value |
HTS | 8542.39.00.01 |
PPAP | No |
Type | General Purpose |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 28 |
Automotive | No |
Output Type | CMOS |
PCB changed | 28 |
Part Status | Active |
Coupling Type | Magnetic Coupling |
Package Width | 7.5 |
Package Height | 2.34 |
Package Length | 10.2 |
Supplier Package | SOIC W |
Maximum Data Rate | 100Mbps |
Process Technology | iCoupler |
Maximum Fall Time (ns) | 2.5(Typ) |
Maximum Rise Time (ns) | 2.5(Typ) |
Forward/Reverse Channels | 0/4 |
Minimum Pulse Width (ns) | 10 |
Number of Channels per Chip | 4 |
Maximum Power Dissipation (mW) | 2780 |
Minimum Isolation Voltage (Vrms) | 5000 |
Maximum Output Current Drive (mA) | 10 |
Maximum Working Insulation Voltage | 566Vp |
Maximum Operating Temperature (°C) | 125 |
Maximum Propagation Delay Skew (ns) | 8 |
Maximum Pulse Width Distortion (ns) | 5 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Supply Voltage (V) | 5.5 |
Minimum Operating Supply Voltage (V) | 1.7 |
Typical Operating Supply Voltage (V) | 1.8|2.5|3.3|5 |
Maximum Quiescent Supply Current (mA) | 16 |
Minimum Common Mode Rejection (kV/us) | 75 |
Maximum Propagation Delay Time (tPHL) (ns) | 17 |
Maximum Propagation Delay Time (tPLH) (ns) | 17 |
Description |