Product Attribute | Attribute Value |
HTS | 8542330001 |
PPAP | Yes |
Type | General Purpose |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 8 |
Automotive | Yes |
Lead Shape | Gull-wing |
Output Type | CMOS |
PCB changed | 8 |
Part Status | Active |
Coupling Type | Capacitive Coupling |
Package Width | 3.98(Max) |
Package Height | 1.5(Max) |
Package Length | 5(Max) |
Supplier Package | SOIC |
Maximum Data Rate | 25Mbps |
Process Technology | CMOS|TTL |
Standard Package Name | SOP |
Maximum Fall Time (ns) | 2.6 |
Maximum Rise Time (ns) | 3.1 |
Forward/Reverse Channels | 2/1 |
Number of Channels per Chip | 2 |
Maximum Power Dissipation (mW) | 56 |
Minimum Isolation Voltage (Vrms) | 3000 |
Maximum Output Current Drive (mA) | 15 |
Maximum Operating Temperature (°C) | 125 |
Maximum Pulse Width Distortion (ns) | 4 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Supply Voltage (V) | 5.5 |
Minimum Operating Supply Voltage (V) | 3 |
Maximum Quiescent Supply Current (mA) | 2.3/6.8 |
Minimum Common Mode Rejection (kV/us) | 25 |
Maximum Propagation Delay Time (tPHL) (ns) | 66 |
Maximum Propagation Delay Time (tPLH) (ns) | 66 |
Description |