Product Attribute | Attribute Value |
HTS | 8542.39.00.01 |
PPAP | No |
Type | High Speed |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 8 |
Automotive | No |
Lead Shape | Gull-wing |
Output Type | CMOS |
PCB changed | 8 |
Part Status | Active |
Coupling Type | Capacitive Coupling |
Package Width | 3.98(Max) |
Package Height | 1.5(Max) |
Package Length | 5(Max) |
Supplier Package | SOIC |
Maximum Data Rate | 25Mbps |
Standard Package Name | SOP |
Maximum Fall Time (ns) | 2.6(Typ) |
Maximum Rise Time (ns) | 3.1(Typ) |
Forward/Reverse Channels | 1/1 |
Number of Channels per Chip | 2 |
Maximum Power Dissipation (mW) | 67 |
Minimum Isolation Voltage (Vrms) | 3000 |
Maximum Output Current Drive (mA) | 15 |
Maximum Working Insulation Voltage | 400Vrms |
Maximum ESD Protection Voltage (kV) | ±1.5@CDM/±4@HBM |
Maximum Operating Temperature (°C) | 125 |
Maximum Pulse Width Distortion (ns) | 4 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Supply Voltage (V) | 5.5 |
Minimum Operating Supply Voltage (V) | 3 |
Typical Operating Supply Voltage (V) | 3.3|5 |
Minimum Common Mode Rejection (kV/us) | 25 |
Maximum Propagation Delay Time (tPHL) (ns) | 66 |
Maximum Propagation Delay Time (tPLH) (ns) | 66 |
Description |