Product Attribute | Attribute Value |
HTS | 8542330001 |
PPAP | No |
Type | General Purpose |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tape and Reel |
Pin Count | 8 |
Automotive | No |
Lead Shape | Gull-wing |
Output Type | Logic |
PCB changed | 8 |
Part Status | Active |
Coupling Type | Capacitive Coupling |
Package Width | 3.98(Max) |
Package Height | 1.5(Max) |
Package Length | 5(Max) |
Supplier Package | SOIC |
Maximum Data Rate | 50Mbps |
Process Technology | CMOS|TTL |
Standard Package Name | SOP |
Maximum Fall Time (ns) | 2(Typ) |
Maximum Rise Time (ns) | 2(Typ) |
Forward/Reverse Channels | 2/0 |
Number of Channels per Chip | 2 |
Minimum Isolation Voltage (Vrms) | 2500 |
Maximum Working Insulation Voltage | 566Vp |
Maximum ESD Protection Voltage (kV) | 1.5@CDM/3@HBM/0.2@MM |
Maximum Operating Temperature (°C) | 125 |
Maximum Pulse Width Distortion (ns) | 2 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Supply Voltage (V) | 5.5 |
Minimum Operating Supply Voltage (V) | 3 |
Minimum Common Mode Rejection (kV/us) | 25 |
Maximum Propagation Delay Time (tPHL) (ns) | 34 |
Maximum Propagation Delay Time (tPLH) (ns) | 34 |
Description |