Product Attribute | Attribute Value |
HTS | 8542330001 |
PPAP | No |
Type | SPI |
EU RoHS | Compliant |
Mounting | Surface Mount |
ECCN (US) | EAR99 |
Packaging | Tube |
Pin Count | 16 |
Automotive | No |
Lead Shape | Gull-wing |
Output Type | CMOS|LVCMOS |
PCB changed | 16 |
Part Status | Active |
Coupling Type | Capacitive Coupling |
Package Width | 14.1(Max) |
Package Height | 2.29 |
Package Length | 10.4(Max) |
Supplier Package | SOIC |
Maximum Data Rate | 100Mbps |
Standard Package Name | SOP |
Maximum Fall Time (ns) | 3.9 |
Maximum Rise Time (ns) | 3.9 |
Forward/Reverse Channels | 3/1 |
Number of Channels per Chip | 4 |
Maximum Power Dissipation (mW) | 200 |
Minimum Isolation Voltage (Vrms) | 5700 |
Maximum Output Current Drive (mA) | 15 |
Maximum Working Insulation Voltage | 2000Vrms |
Maximum ESD Protection Voltage (kV) | ±1.5@CDM/±6@HBM |
Maximum Operating Temperature (°C) | 125 |
Maximum Pulse Width Distortion (ns) | 4.2 |
Minimum Operating Temperature (°C) | -55 |
Maximum Operating Supply Voltage (V) | 5.5 |
Minimum Operating Supply Voltage (V) | 2.25 |
Typical Operating Supply Voltage (V) | 2.5|3.3|5 |
Minimum Common Mode Rejection (kV/us) | 100 |
Maximum Propagation Delay Time (tPHL) (ns) | 17.5 |
Maximum Propagation Delay Time (tPLH) (ns) | 17.5 |
Description |